The requirement as follows
Job title: Packaging Engineer
Duration: 12+ months
Location: REMOTE
Skills:
• Hands-on experience in the design of semiconductor packages, multi-chip modules and PCB's using tool suites from Mentor and Cadence.
• Understanding of semiconductor packaging technology like wire bond, flip chip and wafer level packaging.
• Familiarity with image sensors and camera modules would be a plus
• 7-10 years’ of experience in hands-on Package/Module/PCB design
• BS/MS/equivalent experience in engineering; PhD preferred
Tools to know:
1. Cadence (APD/PCB Designer/OrCAD)
2. Mentor (Hyperlynx/Expidition)
3. HFSS
4. ANSYS
5. Sigrity
...aggression or stalking, religion, age, disability, sexual orientation, gender identity or expression, citizenship, ancestry, veteran or military status, marital status, pregnancy, genetic information or any other characteristics protected by law. #J-18808-Ljbffr Luxottica
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